Cadence® system design and verification solutions, integrated under our Verification Suite, provide the simulation, acceleration, emulation, and management capabilities.
Verification Suite Related Products A-Z
Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.
Full-Flow Digital Solution Related Products A-Z
Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.
Overview Related Products A-Z
Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.
Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.
An open IP platform for you to customize your app-driven SoC design.
Comprehensive solutions and methodologies.
Helping you meet your broader business goals.
A global customer support infrastructure with around-the-clock help.
More Support Log In
24/7 Support - Cadence Online Support
Locate the latest software updates, service request, technical documentation, solutions and more in your personalized environment.
Cadence offers various software services for download. This page describes our offerings, including the Allegro FREE Physical Viewer.
The Cadence Academic Network helps build strong relationships between academia and industry, and promotes the proliferation of leading-edge technologies and methodologies at universities renowned for their engineering and design excellence.
Participate in CDNLive
A huge knowledge exchange platform for academia to network with industry. We are looking for academic speakers to talk about their research to the industry attendees at the Academic Track at CDNLive EMEA and Silicon Valley.
Come & Meet Us @ Events
A huge knowledge exchange platform for academia. We are looking for academic speakers to talk about their research to industry attendees.
Americas University Software Program
Join the 250+ qualified Americas member universities who have already incorporated Cadence EDA software into their classrooms and academic research projects.
EMEA University Software Program
In EMEA, Cadence works with EUROPRACTICE to ensure cost-effective availability of our extensive electronic design automation (EDA) tools for non-commercial activities.
Apply Now For Jobs
If you are a recent college graduate or a student looking for internship. Visit our exclusive job search page for interns and recent college graduate jobs.
Cadence is a Great Place to do great work
Learn more about our internship program and visit our careers page to do meaningful work and make a great impact.
Get the most out of your investment in Cadence technologies through a wide range of training offerings.
Overview All Courses Asia Pacific EMEANorth America
Instructor-led training [ILT] are live classes that are offered in our state-of-the-art classrooms at our worldwide training centers, at your site, or as a Virtual classroom.
Online Training is delivered over the web to let you proceed at your own pace, anytime and anywhere.
Exchange ideas, news, technical information, and best practices.
The community is open to everyone, and to provide the most value, we require participants to follow our Community Guidelines that facilitate a quality exchange of ideas and information.
It's not all about the technology. Here we exchange ideas on the Cadence Academic Network and other subjects of general interest.
Cadence is a leading provider of system design tools, software, IP, and services.
I am currently working on a design that shall utilize stacked micro vias from 1 to 4 with a buried mechanical from 4 to 5 followed by stacked micro vias from 5 to 8. We cannot stack on the buried mechanical from Layer 4 to 5 and the micro's must be offset from it. Is it possible to adjust the constraint manager to allow the micro's to be stacked and only apply the offset to the mechanical with the Performance L Option?
When I adjust the Min BB Via stagger value it applies the offset to the entire stack. When I created the padstacks for the vias I checked the radio button for Micro Via's and did not for the burried mechanical. I was hoping this was a flag to the CM but I assume it is not. Any help would be appreciated.
The microvia checkbox in Pad Designer creates a new via type in constraint manager called microvia which you can them set different rules to bbvias, vias etc. You need the Miniaturization option for 16.5 and 16.6 or XL version for 16.2, 16.3 to get this extra added via domain which gives you full HDI functionality. Without this option they are just bbvias and you may struggle to define the required rules..
In reply to steve:
Thanks for following up. This will be painful. I guess I will need to come up with a work around.
In reply to CCR77:
Will this be painful only because you don't have the necessary licenses? If not, it is very easy. Once you set the switch to Microvia in the padstack editor, it seperates those vias from bbvias. Then you just change the pad-pad-connect setting in the Physical section of the Constraint Manager to microvia to microvia coincident only. This allows microvias to be stacked but not to bbvia. We do this all the time.
It is easy.....trust me...;-)
In reply to Boma:
You are correct. My team purchased performance L licenses, however I have access to XL licenses if they are not needed by another group. I quickly tested with XL and it works as you suggested, the issue is that I dont have priority with the XL editor and could be requested to drop it any time.... :(