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Hi guys,There is a old question. The answer might be quite simple, but it has confused me a long time.Please give show me the light of hope.The assumption is: there is a board, whose layer 3 is a negative plane(net GND),and there is a via(Net gnd).Now I need that via connect two pins placed at Top and Bottom,but it cannot be connected with the GND layer3.Methord1If i defined a circle that is bigger than the drilled hole as the thermal-relief of a pad,(Abti-pad is also defined),then in the step of Artwork Generation,The warning would likely be" no Thermal-relief,regular pad instead",but the occurrence of the pad mey be different from other normal pad(flash as thermal-relief and anti-pad),as shown in CAM software.The size of the pad would be the regular pad,obviously bigger than the hole. Now my question is:Would The via connect with the layer3?If the warning pad(regular pad) was plot away,then the result is NO;Otherwise, The answer must be Yes,right?Methord2if i define a Flash whose Outer-diameter is even smaller than the Hole,then in the step of artwork generation,there would propablily no warnings companied with.then when the flash was plot away,the pad would full-connect with the layer3.Is the conclusion rihgt?Thanks a millionKobe NCUT