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Hello guys,Same topic here?No.It was seperation once. It is full connection now.I'd quote my previous methord,which was not payed attention on.A via, a negative plane, both net gnd.Set a flash whose o-d is smaller then the diameter of the relavent drilled hole. would the via be full-conneted with the plane?Set the thirmal relief null or circle.then when generating artwork, there would be a warning"regular pad instead". Finally the artwork could identify the via with warning,anddiscard the via.Only the the hole would be in use when the board is manufactured.Then would the via be full-conneted with the plane?Regards,Summer NCUT
I agree.Setting a flash outer diameter samller then the diameter of the drill would be a full-connect to its assoicated plane.I have been doing this for a long time and it works without fail. My only suggestion is specify a Thermal Flash namewhich is descriptive like "DIRECT_CONNECTION" , "FULL_CONTACT", "NO_THERMAL" so its clear to the FAB Vendor what needs to be done.At one time setting the Thermal Relief to NULL would cause an errror or unepected results during artwork generation.I seem to rememeber the regular pad being used in these cases but the results may not be what you are looking for.Anyone else out there have an ideas or suggestions ?Hope this helps,Mike Catrambone
Oh, I think if the regular pad is applied for substitution, it would likely be no other than "seperation"My consideration is the size: regular pad is bigger than the drilled hole, but smaller than the anti-pad.regularly,right?then,if the common seperation way is to plot the antipad away in the layer,how about plot away the regular pad away,according to the same charactor of both regular pad and antipad: bigger dia than the drilled-hole.Is that possible?Mike,thank you very much, i believe that your sharing the smaller-flash experience has greately helped and encouraged me!NCUTsummer