Cadence® system design and verification solutions, integrated under our System Development Suite, provide the simulation, acceleration, emulation, and management capabilities.
System Development Suite Related Products A-Z
Cadence® digital design and signoff solutions provide a fast path to design closure and better predictability, helping you meet your power, performance, and area (PPA) targets.
Full-Flow Digital Solution Related Products A-Z
Cadence® custom, analog, and RF design solutions can help you save time by automating many routine tasks, from block-level and mixed-signal simulation to routing and library characterization.
Overview Related Products A-Z
Driving efficiency and accuracy in advanced packaging, system planning, and multi-fabric interoperability, Cadence® package implementation products deliver the automation and accuracy.
Cadence® PCB design solutions enable shorter, more predictable design cycles with greater integration of component design and system-level simulation for a constraint-driven flow.
An open IP platform for you to customize your app-driven SoC design.
Comprehensive solutions and methodologies.
Helping you meet your broader business goals.
A global customer support infrastructure with around-the-clock help.
24/7 Support - Cadence Online Support
Locate the latest software updates, service request, technical documentation, solutions and more in your personalized environment.
Cadence offers various software services for download. This page describes our offerings, including the Allegro FREE Physical Viewer.
The Cadence Academic Network helps build strong relationships between academia and industry, and promotes the proliferation of leading-edge technologies and methodologies at universities renowned for their engineering and design excellence.
Participate in CDNLive
A huge knowledge exchange platform for academia to network with industry. We are looking for academic speakers to talk about their research to the industry attendees at the Academic Track at CDNLive EMEA and Silicon Valley.
Come & Meet Us @ Events
A huge knowledge exchange platform for academia. We are looking for academic speakers to talk about their research to industry attendees.
Americas University Software Program
Join the 250+ qualified Americas member universities who have already incorporated Cadence EDA software into their classrooms and academic research projects.
EMEA University Software Program
In EMEA, Cadence works with EUROPRACTICE to ensure cost-effective availability of our extensive electronic design automation (EDA) tools for non-commercial activities.
Apply Now For Jobs
If you are a recent college graduate or a student looking for internship. Visit our exclusive job search page for interns and recent college graduate jobs.
Cadence is a Great Place to do great work
Learn more about our internship program and visit our careers page to do meaningful work and make a great impact.
Get the most out of your investment in Cadence technologies through a wide range of training offerings.
Overview All Courses Asia Pacific EMEANorth America
Instructor-led training [ILT] are live classes that are offered in our state-of-the-art classrooms at our worldwide training centers, at your site, or as a Virtual classroom.
Online Training is delivered over the web to let you proceed at your own pace, anytime and anywhere.
Exchange ideas, news, technical information, and best practices.
The community is open to everyone, and to provide the most value, we require participants to follow our Community Guidelines that facilitate a quality exchange of ideas and information.
It's not all about the technlogy. Here we exchange ideas on the Cadence Academic Network and other subjects of general interest.
Cadence is a leading provider of system design tools, software, IP, and services.
MaliWhat technology node are currently in? Which type of timing model is your third party sign-off tool using?
If signoff is still using NLDM models, it may turn out to be that ETS + CCS or ECSM models are 3-5% more accurate.If both are using the same model types we normally expect better timing correlation, especially if both timing engines are using the same parasitic extraction source files.There is lots of online documentation worth reading ....Shawn
In reply to fitz:
We are currently using 28hpm.
I am comparing
ETS + NLDM with TPT + NLDM (2% difference average for a bunch of our designs)
ETS + CCS with TPT + CCS (3-5% difference)
So, the comparison is based on same library models and same parasitic source files.
So does anyone here have any data on how close CCS is with respect to silicon results. +/- any percent value on the average.
Should we consider moving to CCS/ECSM for signoff, any strong reasons.
In reply to maliv:
I'm sure your local Cadence AppEng can tweak "out of the box" ETS+CCS to be more in line with PT+CCS.ETS + NLDM vs ETS + CCS comparison results might be more informative.In the end working silicon is the ultimate goal! ( and what your silicon vendor dictates for signoff ) We started to see the NLDM flow fall apart at 65nm, so much extra margin was built into the vendor flow to cover the modeling inaccuracies, that our data path performance suffered.It took a lot of pressure to convince the vendor to switch to the more accurate CCS based flow and remove the "excessive" margin, that got our silicon back up to speed and reduced power to bootAt 28nm I don't think we could easily achieve working silicon with NLDM models. I'm surprised that your silicon vendor even supports NLDM based signoff. ( then again fabs do love the excess margin )Start with the Cadence online documentation, then try general online searches to get a few second opinions.Second talk to your local Cadence AppEng and get the low down on what is required, then try and bring your silicon vendor in line.The next year(s) of your life depend on understanding all of the ramifications, 28nm timing closure can be absolute hell or just rather warm . Using 3rd party signoff can also turn the thermostat way up. Shawn