SKILL for Substrate Integrated Waveguide layout

Hi Jack,

There are many factors involved but I have a few suggestions. First, you can use dbLayerTile() to fracture a polygon into trapezoids, you can then further process any that are not rectangular into approximations of rectangular areas. From the rectangular areas you might then use something like dbCreateViaShapeArray() or dbCreateVia() with appropriate rows, columns, spacing etc. For any slotted areas you could use dbCreateOverlaps() to identify areas that should be free of vias/via shapes and remove those using dbDeleteObject() (i.e. delete them after they were created, rather than trying to decide up front if they should be created). You might need to align vias/cut shapes and so you could use rodAlign() or leAlign() (don't use the latter in a PCell, if you are creating PCells). You might use something like techGetLayerFunctions() to identify the metals and vias between in a more generic fashion than hard-coding the values. Similarly you might use techGetSpacingRule() and techGetOrderedSpacingRule() to get the information on spacings etc. more generically.

Hopefully this helps?

Best regards,

Lawrence.