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how to chose metallization type for bond pad

Greatrebel

 Hi All,

I am designing P&R for a chip. I have a few options for bond pad. Those options are different in metallization tape, for example, 6 metal layers with X metallization and top 2 metal layers with Y metallization; 6 metal layers with X metallization and top 2 metal layers with N metallization.

Can anyone tell what is the difference among various metallization choices such as X, Y, Z, N, U.

Thanks in advance

  • Kari

     The difference among the metallization choices is going to be specific to your process. You'll need to consult the design rule manual for the process.

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