Does anyone have any suggestions on creating footprint with thermal pad that requires topside via tenting on the top side?
I tried making shape symbols for solder mask/ paste mask, but due to the void in the shape it requires I am not able to create it.
I can place the shapes manually in package geo/ SM or PM, but I think lot of the data does not have it to display in the default setting for our filmsetting.
Please let me know if there is a way to make the shape symbols or not.
Thanks in advance.
It was one of the suggested method I saw online. We are trying to find a good way to avoid fill/cap these vias to cut cost. Our assembly side does not like to keep it vias open due to solder wicking.
From what I see, the document shows the soldermask around the via, but not completely covered on top side. They suggest capping the top side is better than bottom side on this article so we wanted to experiment with few different options to see what the assembly will prefer.