Splitting Stacked Vias in OrCAD X Presto

Stacked vias involve placing of multiple vias directly on top of each other across different layers of a PCB to form a continuous electrical connection. This method saves space and enhances routing options, particularly in high-density interconnect (HDI) PCBs. Stacked vias help improve signal integrity and reduce inductance and resistance in the circuit paths. 

A via stack is an arrangement of two or more same-net vias directly connected at the same location, with adjacent vias in the stack sharing one common layer. Sliding a via stack enables splitting the stack into a substack or a single via.  

In OrCAD X Presto, the Split Stack option is available with a Professional license. 

 To split stacked vias, do the following: 

1. Click on the Slide icon from the floating command toolbar. 

             The Slide widget opens. 

       2. Select stacked vias. Ensure that vias are enabled in the Selection Filter. 

Stacked vias slide as a single object that includes a group of vias and their connections, regardless of the via selected in the stack. 

       3. Right-click and choose Split Stack. 

Via selection window is displayed showing the stacked vias and layer numbers. 

     4. In the via selection window, click on the right edge to choose a single via. To choose a range of vias, hold the left mouse button and click the vias

The selection of vias is indicated in blue. The selected via or via stack is separated from the primary via stack and can be slid independently.