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Of interest: "Chips-in-a-SiP” are a circuit simulation headache"

Of interest to folks in this forum: In the latest “Chip Design” magazine, there is an article titled: “‘Chips-in-a-SiP’” are a circuit simulation headache”

Inked by Cadence’s Taranjit Kukal and Keith Felton, the authors describe how today's chip-level circuit simulation environment needs to be able to attach IC package technology to the chip design. Have a read and share your thoughts below.

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