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EDN blogger talks about Allegro 16.2 release

Of interest to readers of this forum. An EDN blogger today talks about our SPB 16.2 release.

“Cadence is underlining the observation that no longer can we regard PCB design as somehow a simple process, and package design as a mechanical problem,” writes EDN executive Editor Ron Wilson.

“With passive components migrating off of silicon dice and into packages or boards, with high-density three-dimensional structures that are electrically part of the circuit design, and with even higher speeds and densities on the horizon, this is a new world. The next big question is how the tools will track the migration from today's stack-die, wire-bonded SiPs to the true 3D IC concepts now working in labs around the world.”

Read the entire blog post here.

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