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uVia to SMD pin DRC's

package design

 We have some UVIA to SMD PIN placement. It is possible that we have some uvia offset by pad center (Die size changes / copy / paste). Is it possible to check / flag DRC’s?

 FC bump :   (-7710.50 -3451.18)

Via : (-7710.50 -3453.70)
Note :  Via is offset from center of FC pad by 2 um and it should be placed at center.

In the CMS we have enabled SMD pin to Microvia / BB via option, eventhough it's not flagginf DRC's bcoz the Via size is smaller than pad size. Rite now we are reducing the pad size & checking the DRC"s later increasing the pad sizes :-(

  • What version of code are you running? I believe we added a"coincidence" check in 16.3, but let me confirm and get the details.

    For your shape generation issue, have you worked with your local AE or support person? If you would like to contact me direct, please do, and I will capture your request for future consideration (I'd like to get more details).

    wacito [@] cadence [dot] com

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