Stats

  • Replies 0
  • Subscribers 64
  • Views 662
  • Members are here 0
More Content

IC Packaging Blog -- A wealth of information from the Cadence ICP team

BillAcito

Package Designers --

I'd like to point out (and provide the link to) the Cadence IC Packaging blog. Recent posts from the ICP team highlight how to take advantage of the new 16.6 features, as well as overviews of our existing capabilities, and how our customers are leveraging our tools to design packages in the context of the die and PCB, shortening their design cycle time in the process. Subscribe and get email notifications as we highlight more capabilities throughout 2013.

Regards, 

 Bill

 

Cadence Guidelines

Community Guidelines

The Cadence Design Communities support Cadence users and technologists interacting to exchange ideas, news, technical information, and best practices to solve problems and get the most from Cadence technology. The community is open to everyone, and to provide the most value, we require participants to follow our Community Guidelines that facilitate a quality exchange of ideas and information. By accessing, contributing, using or downloading any materials from the site, you agree to be bound by the full Community Guidelines.