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Proper routing of trace between bumps (WLCSP or FC design)

Nomer

Hi, I am routing a trace zigzagging between several Bumps. Somebody suggested that I should keep the traces CENTERED between the bumps so that it is easier to process in etching. But as an effect, the trace became longer. I got a lot of space between the bumps since the design is not dense. I have always believed that, in general, the shorter the trace is, the better (except when electrically required to lengthen the path). The customer did not give specific routing requirements and also would not give the application of their device so I could only ask 'in general'.

So therefore, which is better?

1) center the trace between the pads but in effect, increases the trace length

2) allow traces to get closer to the bumps (note: still within HVM Design rule) and get shorter trace

Hope to get response from anybody.

Regards, Noms

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