Stats

  • Replies 1
  • Subscribers 67
  • Views 12351
  • Members are here 0
More Content

How do you create a footprint symbol for a DIE that will be referenced in system capture schematic?

pattiwack

Hi,

I am able to create a die in APD using a CSV file using the Die text-in wizard.  I am them able to export libraries to create the symbol for the die.  I then use the symbol name when I create the system capture schematic symbol.  When I try to import the netlist from my schematic, the part for the die component is accounted for but the pins are no longer on the wirebound layer they have been converted to the top conductor layer.  In addition to this I can't wirebond to the pins only connect via traces.

Please advise if my workflow I'm using is incorrect.  Also how do I maintain the die pins to be used for wirebond connections when importing a netlist from a schematic?

Regards,

Matt

  • Hi Matt,

    Thanks for sharing your process. To preserve the die pins for wirebond connections when importing a netlist from a schematic, you can double-check your export settings and make sure the die pins are properly defined on the wirebond layer. Make sure you have configured the pin properties correctly in the library before exporting. If the problem persists, you can try regenerating the symbol with more appropriate parameters or refer to the software documentation for more details.

    Hope this helps!

Cadence Guidelines

Community Guidelines

The Cadence Design Communities support Cadence users and technologists interacting to exchange ideas, news, technical information, and best practices to solve problems and get the most from Cadence technology. The community is open to everyone, and to provide the most value, we require participants to follow our Community Guidelines that facilitate a quality exchange of ideas and information. By accessing, contributing, using or downloading any materials from the site, you agree to be bound by the full Community Guidelines.