Can the bond wire text input function in cadence sip realize automatic wire bond connection?

I also wonder if that automatic connection was made from there. bubble shooter  spin the wheel

Otherwise, so many bonding wires have to be manually connected?

I have 128 fingers and 400 die pads，Manually connecting the bonding wire is time-consuming

Certainly, the bond wire text in command can generate the bond wires for you. To be able to do that, it will need to be able to find valid objects to connect to at both sides. So, if you've got stacked dies and stuff, you'll need to include the layer the pads are on, so that it can distinguish which of the pins you want to connect the wire to (similar with the finger/ring side of things). 

Or, if you're going for simply connecting things up in the best way that doesn't result in any shorts or crossed wires, select all the die pads (usually one die at a time) in the wire bond application mode. RMB -> Add Wire Bond, then just turn off the checkbox at the top of the options tab labelled "finger". This tells the system you only want to add a wire, and that it should find the best destination based on your cursor movement -- so you can see where things will connect up before committing them. You can then tell it you want to connect up to fingers or to die pads at the far end of the wire. 

From what you've described, I'd think that the add wire feature would be faster. But, if you have tack point offsets on the pins or fingers, etc, and know exactly where you want each end point to go for the wires, the text in flow is the one you want.

- Tyler