DFA check space of compont to BGA ball or BGA PAD in APD

Hi zpofrp, yes APD can easily create check for bga pin to package. This is done via Manufacturing checks Design For Assembly > Spacing > Component Body to...

This looks as shown in the image below: 

Step 1:Create the rule constraint set.

Step 2: Assign the rule to each layer as desired.

Error example shown for Component Body to "All pin pads" using a standard license. In higher grade licenses we get a more granular checking ability as per the image below:

I try it, its OK in a new design. But i set it in a old design, it is wrong.

There are many dielectrics above the top layer in the old design. There are many dielectrics below the bottom layer in the old design. This dielectrics are for substrate engineering.

I don't know what caused it.

I guess the compont is be placed on dielectric, for example slod-bot，slod-top/