ODB++ Output places components on wrong side

Hello wilef, may I know the APD and also ODB++ Version you are using. I have exported the odb++ with a flipchip die placed in the bottom and could see the pins of flipchip on the bottom layer. 

APD designs with flip chip dies on the top and bottom of the board are coming in wrong. Siemens only goes off the 'mirrored' property to determine whether components go on the top or bottom view. So I have all my components showing on the top because my backside flip chip is 'not mirrored'. Also my package outline footprint is on the top because it was designed not mirrored. If I have topside flip chip dies, they stay on top because block blast are 'mirrored geometry'. Anyone else have a workaround for this issue? Siemens says it's 'not a bug' and that the 'have always done it this way', but I find it hard to believe that no one else has this issue. Flip chip dies must be designed bumps up and the tool will mirror the geometry for topside mounting and just not mirror it for backside placement.

I think you can try to confirm the "Two Die Library" Approach. This is your most likely path to success. Experiment with a small test case:

Create a simple flip-chip die library part with bumps "up." Place it on the top layer and apply "mirrored." Verify it looks correct.
Create a second version of the same die, but this time, in your die creation process, design it geometrically flipped (bumps "down" relative to the initial design view). Place it on the bottom layer and apply "not mirrored." See if it appears correct. If this works, it's the confirmed workaround.

APD 23.1, latest ODB++ version. Was your bottom side flip chip 'mirrored' or 'unmirrored'? Cadence setup these parts a certain way and Siemens wants them the opposite way.