Stats

Replies 0
Subscribers 158
Views 8691
Members are here 0

How to create a Two-Sided die using Allegro Package Designer?

In today’s packaging world, dual sided die placements are needed in advanced and complex designs. The most common component involves wire bond pads on the top of the die with micro bumps on the bottom. However, other combinations like flipchip/flipchip devices are also possible.

To get an overview of how to create/modify a Two-Sided die, click here.

Team PCBTech

Cadence Design Systems

Cadence Guidelines

Community Guidelines

The Cadence Design Communities support Cadence users and technologists interacting to exchange ideas, news, technical information, and best practices to solve problems and get the most from Cadence technology. The community is open to everyone, and to provide the most value, we require participants to follow our Community Guidelines that facilitate a quality exchange of ideas and information. By accessing, contributing, using or downloading any materials from the site, you agree to be bound by the full Community Guidelines.