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How to create a Two-Sided die using Allegro Package Designer?

PCBTech

In today’s packaging world, dual sided die placements are needed in advanced and complex designs. The most common component involves wire bond pads on the top of the die with micro bumps on the bottom. However, other combinations like flipchip/flipchip devices are also possible.

To get an overview of how to create/modify a Two-Sided die, click here.

Team PCBTech

 

Cadence Design Systems 

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