Wirebonding

Bond wires are 3D entities that curve through space to connect a die pin to a bond finger or another die pin. The wires follow a path, which is termed a wire profile.

The bond wires are fine wires made of materials like gold and aluminium. The two most common processes are ball bonding (gold) and wedge bonding (aluminium). The wirebond technology is widely used, inexpensive, and reliable.

In the packaging industry, die attachments can be both Wirebond/Chip up and Wirebond/Chip down.

Chips can also be directly mounted over a PCB and can be wirebonded, very similar to the one used in packaging. This is what we call COB (Chip on Board).

Cadence Allegro Package Designer+ and SiP IC package design tools provides you the means to design a wirebonded die. The tools provide a Wire Profile Editor for defining a wire profile, the model applied to the bond wires. You have the flexibility to adjust the various wirebond settings to meet the requirements.

The tools also provide you the option to view the wirebonded die in a 3D capability.

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Cadence Design Systems