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Use of Bond finger in PCB editor

Ram1234

Hi all,

Good day!...

I am little confisued about bond finger in constraint manager.

Please clarify where to use bond finger constraint for PCB layout.

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  • John T
    +1

    Hi Ram1234, bond fingers are special pad types which are associated with wirebond technology. This area is generally known as Chip-on-Board assembly process, or  Direct Chip Attachment (DCA). Wires and fingers are “read only” inside Allegro PCB Designer and these packages can be generated in the Advanced Package Designer Plus and System In Package (SIP) tool suites. Due to the special nature of this technology, additional rules should be set according to the assembly principles surrounding this die attach methodology. 

    More information can be found in IPC-SM-784; Guidelines for Chip-on-Board Technology Implementation, on the Cadence Online Support or other online sources. 

Reply
  • John T
    +1

    Hi Ram1234, bond fingers are special pad types which are associated with wirebond technology. This area is generally known as Chip-on-Board assembly process, or  Direct Chip Attachment (DCA). Wires and fingers are “read only” inside Allegro PCB Designer and these packages can be generated in the Advanced Package Designer Plus and System In Package (SIP) tool suites. Due to the special nature of this technology, additional rules should be set according to the assembly principles surrounding this die attach methodology. 

    More information can be found in IPC-SM-784; Guidelines for Chip-on-Board Technology Implementation, on the Cadence Online Support or other online sources. 

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