Embedded layer setup in cross section

Hi Ram1234, In the cross section tab we can enable the embedded status to allow/disallow components from being placed on selective internal layers. We must also set the internal component attach method to Body Up, Body Down, and Protruding Allowed. The value Not Embedded prevents a component from being placed on that internal layer. We can also set if adjacent “protruding” is allowed choosing to permit if a component can cut into another layer given its height. 

Below are some of the parameters associated with Embedded Component Design which are available in the Cross-section Editor – Embedded Layer Setup tab. Please note that hovering over the parameter name or value field displays a brief description.

• Package height buffer: Defines a clearance or buffer when calculating component height violations in a substrate. For example, you may have concerns about placing a 10 mil tall component in a 12 mil substrate. The value entered in this field is essentially added to the height of the components placed on the embedded layer.
• Minimum cavity gap for merging: Defines the minimum spacing between the edges of a cavity before a merger takes place.

Note: Not all vendors support merged or super cavities.It is recommended to verify fabricator’s process before using cavities.

• Placebound to via keepout expansion: Creates an extended via keepout area about the placebound geometry. Follow the guidelines recommended by fabricator.

• Package to Cavity:This parameter is actually a constraint and defines the clearance from the edge of the placebound shape to the cavity outline.

• Cavity to Route Keepout Expansion:This parameter becomes relevant when a layer is set to Protruding allowed. While the cavity has inherent route keepout behavior, it may be desirable to extend the keepout area beyond the cavity profile