PCB Temperature getting in charging

I have some generic suggestions to the first query and presume you are already following many of these.

Using Fan to cool, heat sinks, and increase the thickness of the copper to remove heat from components and PCB.

Using high thermal conductivity and low thermal resistance materials and components.

Enhance heat dissipation by increasing the plating thickness and trace width.

Placing components with sufficient spacing to allow air to pass through.

Overheating components should be placed near the board edge and separated from the heat sensitive components.

Using thermal vias to dissipate heat and thermal spokes for through pins and vias.

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Can you elaborate what you are looking for from the 2nd and 3rd query, length matching is the constraint for I2C traces.

The trace length should be matched for the SCL and SDA traces to match the rise/fall and setup time.

There should be a guard trace (Ground) between the traces to prevent crosstalk.

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Hope this helps.