• Skip to main content
  • Skip to search
  • Skip to footer
Cadence Home
  • This search text may be transcribed, used, stored, or accessed by our third-party service providers per our Cookie Policy and Privacy Policy.

  1. Community Forums
  2. Allegro X PCB Editor
  3. PCB allegro 17.4 CoB wirebond to die pin limitation =10...

Stats

  • State Suggested Answer
  • Replies 4
  • Answers 1
  • Subscribers 160
  • Views 5393
  • Members are here 0
More Content

PCB allegro 17.4 CoB wirebond to die pin limitation =100

SebFromGeneva
SebFromGeneva over 1 year ago

Hi Cadence experts,

I am working on PCB Allegro 17.4 and I need to design a PCB with a Chip On Board (COB), I would like to use the wirebond functionality as explained here:

community.cadence.com/.../how-to-implement-chip-on-board-cob-technology-by-using-allegro- printed circuit editor

https://support.cadence.com/apex/ArticleAttachmentPortal?id=a1O0V000007MgokUAC


but Allegro does not allow me to connect wirebond because my PCB contains more than 100 die pins to connect... indeed my chip has 128 pins.

so my questions are:

-why this limitation is never mentionned in documentation?

-why this limitation exist  ? 

-I would like to know if anyone knows of a solution to get around this limitation.

-is this limation still there in next version of Allegro 22 or 23?

Seb

PS:

I don't want to use APD+ witch is usefull for packaging but not dedicated for PCB 

I don't have a license for SIP

  • Sign in to reply
  • Cancel
Parents
  • JuanCR
    0 JuanCR over 1 year ago

    Hi SebFromGeneva,

    There are some enhancement requests already in place for exactly what you describe but no clear roadmap on their development. However, as of now, the right workflow is (like yo said) to use APD+ for the creation of the die and then proceed in PCB Editor 

    • Cancel
    • Vote Up +1 Vote Down
    • Sign in to reply
    • Verify Answer
    • Reject Answer
    • Cancel
Reply
  • JuanCR
    0 JuanCR over 1 year ago

    Hi SebFromGeneva,

    There are some enhancement requests already in place for exactly what you describe but no clear roadmap on their development. However, as of now, the right workflow is (like yo said) to use APD+ for the creation of the die and then proceed in PCB Editor 

    • Cancel
    • Vote Up +1 Vote Down
    • Sign in to reply
    • Verify Answer
    • Reject Answer
    • Cancel
Children
  • SebFromGeneva
    0 SebFromGeneva over 1 year ago in reply to JuanCR

    Hi JuanCR,

    thank you for your reply.

    what do you mean by "and then proceed in PCB Editor " ?

    I don't see how to start the wirebond in APD+ and continue the routing in PCB editor ...how to merge the both PCB ??? and  related constraint ?

    regards, 

    Seb

    • Cancel
    • Vote Up 0 Vote Down
    • Sign in to reply
    • Verify Answer
    • Cancel
Cadence Guidelines

Community Guidelines

The Cadence Design Communities support Cadence users and technologists interacting to exchange ideas, news, technical information, and best practices to solve problems and get the most from Cadence technology. The community is open to everyone, and to provide the most value, we require participants to follow our Community Guidelines that facilitate a quality exchange of ideas and information. By accessing, contributing, using or downloading any materials from the site, you agree to be bound by the full Community Guidelines.

© 2025 Cadence Design Systems, Inc. All Rights Reserved.

  • Terms of Use
  • Privacy
  • Cookie Policy
  • US Trademarks
  • Do Not Sell or Share My Personal Information