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  3. How to fill the shape between the SMD pins of the FPGA ...

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How to fill the shape between the SMD pins of the FPGA footprint

RohitRohan
RohitRohan over 1 year ago

I have a PCB board containing an FPGA footprint, i have added the fan out for the FPGA, and when i place the ground plane, i can see that there are spaces between the SMD pins (image for reference), how to fill those spaces with the GND plane.

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  • GilMay2
    0 GilMay2 over 1 year ago

    Hello Rohit,

    Will probably need to move fan-out vias much closer to BGA pads. Afterwards, adjust Shape to SMD-Pin and Shape to BB Via to minimum, manufacturable spacing. If the vias are defined as Microvia instead of BB Via, adjust Shape to Microvia to minimum, manufacturable spacing.

    Also, try using using 5 mils or less for "Minimum aperture for gap width".

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  • Robert Finley
    0 Robert Finley over 1 year ago

    We have a pour void under the entire BGA to manage solder ball collapse problems.

    From an SI/EMC standpoint, continuous ground planes inside the stackup are your critical reference planes.

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