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Display Your Know How: Footprints

Which footprint option is best, A or B?

Let’s say your PI specialist advises that this part requires maximum power transfer according to the component rating… Which library footprint do you choose?

Simply answer by letter or include any reason to support your answer. Alternatives and opinions are welcome!

Top Replies

avant over 2 years ago +1

Paste pattern is related to reflow. We would use the manufacturer's data sheet recommendation and have our assembly shop review. The pad can be tied into a copper shape for heat dissipation if required…
Byron365 over 2 years ago +1

Every Contract Manufacturer (CM) I have ever worked with wants option B. I believe this was originally born out of the fact that squeegee blades on solder paste screening equipment wasn't always a steel…
eDave over 2 years ago +1

There is no simple answer to this question. B is going to be a better option for most requirements but the split shown will only give about 30% paste coverage. Using fewer larger tiles would increase the…

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avant over 2 years ago

Paste pattern is related to reflow. We would use the manufacturer's data sheet recommendation and have our assembly shop review.

The pad can be tied into a copper shape for heat dissipation if required. This can be determined by calculating the thermal resistance.
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avant over 2 years ago

Paste pattern is related to reflow. We would use the manufacturer's data sheet recommendation and have our assembly shop review.

The pad can be tied into a copper shape for heat dissipation if required. This can be determined by calculating the thermal resistance.
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