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footprint IPC STANDARD

Hi all,
Is there anybody well- versed in IPC STANDARDS?
tool orcad layoyt + 10.5
I am creating some footprints. for the pads (SMD/TH) I set
top copper size "x "
SMT              "X+5mil"
SPT               "x-5mil"
Is it as per ipc standards ( i have ipc 2222, and 2221, I went through it diff times. still not clear about this)

Can anybody help me to have a clear understanding? ( board fabricators are ready to do the measurments I set up )

thanks
rinj

satya12 over 16 years ago

IPC standard defines paste and mask are same as pad size.
You can define 1:1 as pad,in the manufacturing house they can change as there standards.
Regards,
Satya
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girish over 16 years ago

Hi , I also have some clarification regarding library creation. usually we will multiply by 2mm for the length of the pad & 1.2mm for the width( for eg if pin length :0.75mm & pin width :0.5mm then land pattern size will be 0.75x2=1.5 & Pin width =0.5x1.2=0.6mm using this data for finding vertical pitch & horizantal pitch which pin length we need to consider before multiplication or after multplication )& for very fine pitch devices & QFN packages how we can take care if we multiply by 2 & 1.2 pin will touch each other (we are facing more problem with QFN package during assembly & testing since pads will be burried under the package ) Regards,girish
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satya12 over 16 years ago

If the corner pads are touching each other,then you trim only the corner pads with 45 deg by maintaing 6 to 8 mils air gap.
Regards,
Satya
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Black Pearl over 13 years ago

Hi All, Anybody know where I can download the ipc document for discrete components(IPC-7352). Regards, Anandhan K
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budnoel over 13 years ago

Hello Black Pearl - There is no document IPC-7532 but I believe you want a copy of "Generic Requirements for Surface Mount Design and Land Pattern Standard" IPC-7351B. You may purchase a copy through the IPC at this location: https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=987caa7f-ff93-df11-9e60-002219545fd5 I hope this is helpful for you.
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