• Skip to main content
  • Skip to search
  • Skip to footer
Cadence Home
  • This search text may be transcribed, used, stored, or accessed by our third-party service providers per our Cookie Policy and Privacy Policy.

  1. Community Forums
  2. PCB Design
  3. thru-hole pad design

Stats

  • Locked Locked
  • Replies 5
  • Subscribers 167
  • Views 17376
  • Members are here 0
More Content
This discussion has been locked.
You can no longer post new replies to this discussion. If you have a question you can start a new discussion

thru-hole pad design

sheepdog
sheepdog over 16 years ago

Hi....first post on this forum.

I'm new to OrCAD, working on a fairly simple design.  I have my schematic complete in Capture and I am currently working on designing footprints for all parts in order to generate a valid netlist to port over to PCB Editor (v16.2).  90% of my parts are SMT...I found the design process for SMT symbols pretty straightforward.  I'm now getting into designing footprint symbols for my thru-hole parts and I'm getting stuck.

In pad designer, I'm not quite sure how to properly define the sizes for thermal relief and anti pad.  Looking through some of the supplied .pad files in the ...pcb/pcb_lib/symbols directory, I see many thru-hole .pad files, but they all vary so much, I'm not sure what a good "standard" would be.

For example, say I am designing a simple two layer board.  I have a part with two leads that will mount thru hole.  Say the nominal lead diameter is 24 mils.  I'll add ~6 mils to the nominal to find the proper hole diameter, which works out to 30 mils.  So I figure a good pad diameter for the top and bottom of the board would be twice the finished hole, or 60 mils. 

So now I attempt to design a .pad file for this:

- two etch layers, two mask layers, type is "through"
- hole type is circle drill, plated, with a 30 mil drill diameter
- for the top layer ("BEGIN LAYER"), I define regular pad as "Circle 60" and anit pad "Circle 70" (since I want a 5 mil annulus around the pad, right?).  Does thermal relief need to be defined here?
- What do I enter for the "DEFAULT INTERNAL" layer, regular, thermal relief, and anti pad
- I define the bottom ("END LAYER") the same as the top ("BEGIN LAYER").
- How about SOLDERMASK_TOP/BOTTOM, PASTEMASK_TOP/BOTTOM?  Does anything need to be defined there?

I've had a hard time finding a good tutorial on thru-hold pad design.  Any help/comments would be much appreciated.

  • Cancel
Parents
  • purikku22
    purikku22 over 16 years ago
    hi, in our way, the definition of the pads depends on the fabrication
    house. the pad definition must be in accordance of what the fabrication
    house can manufacture. it differs with every fabrication house. good
    day, eric

    pakistan wrote:
    >
    > I can tell you my way of defining most of the pads.
    >
    > if I had lead size of 24mils I add 6mils in defining drill size the I
    > add 10mils annular ring so the actual pad having 30mils drill and 50
    > mils pad size. add 10 mils in antipad and thermal relief and then copy
    > this stuff in all layer except solder mask. define solder mask 10 mil
    > larger then pad size.
    >
    > It is my practice I am also relatively new to allegro. so if any one
    > knows the better way correct me.
    >
    > Regards
    >
    > Tanveer
    >
    >
    >
    >
    > You received this email because you subscribed to notifications for
    > the Cadence PCB Design Forum. To unsubscribe, log in, go to forums,
    > and change your forum subscriptions.
    >
    > http://www.cadence.com/community/forums/ForumSubscriptions.aspx
    • Cancel
    • Vote Up 0 Vote Down
    • Cancel
Reply
  • purikku22
    purikku22 over 16 years ago
    hi, in our way, the definition of the pads depends on the fabrication
    house. the pad definition must be in accordance of what the fabrication
    house can manufacture. it differs with every fabrication house. good
    day, eric

    pakistan wrote:
    >
    > I can tell you my way of defining most of the pads.
    >
    > if I had lead size of 24mils I add 6mils in defining drill size the I
    > add 10mils annular ring so the actual pad having 30mils drill and 50
    > mils pad size. add 10 mils in antipad and thermal relief and then copy
    > this stuff in all layer except solder mask. define solder mask 10 mil
    > larger then pad size.
    >
    > It is my practice I am also relatively new to allegro. so if any one
    > knows the better way correct me.
    >
    > Regards
    >
    > Tanveer
    >
    >
    >
    >
    > You received this email because you subscribed to notifications for
    > the Cadence PCB Design Forum. To unsubscribe, log in, go to forums,
    > and change your forum subscriptions.
    >
    > http://www.cadence.com/community/forums/ForumSubscriptions.aspx
    • Cancel
    • Vote Up 0 Vote Down
    • Cancel
Children
No Data
Cadence Guidelines

Community Guidelines

The Cadence Design Communities support Cadence users and technologists interacting to exchange ideas, news, technical information, and best practices to solve problems and get the most from Cadence technology. The community is open to everyone, and to provide the most value, we require participants to follow our Community Guidelines that facilitate a quality exchange of ideas and information. By accessing, contributing, using or downloading any materials from the site, you agree to be bound by the full Community Guidelines.

© 2025 Cadence Design Systems, Inc. All Rights Reserved.

  • Terms of Use
  • Privacy
  • Cookie Policy
  • US Trademarks
  • Do Not Sell or Share My Personal Information