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Anyone doing .4mm pitch BGAs yet?

Cadpro2K

Doing a bumped bare die part, .4mm staggered pitch. Is anyone else doing these? Can they be done without stacking the vias to breakout the pattern? I don't see a way but to stack the L1-L2 microvias (via in pad) on top of the buried vias.
Using .010" pads, .004" vias in the pad (L1-L2) and .004" traces to break it out.

Any other ideas?

Thanks.

  • CubbyBear

    We're using .4mm BGA's with stacked HDI microvias using a 4-2-4 stackup. Depending on your board density, it's going to be tough to impossible to break them out otherwise- IMO. The vias are .226x100mm, line's out of the BGA .063mm MIN, .075mm typ. We can stack 4 deep to the Core on either side. We have special HDI vias to specific core layers to pick up PWR, or a drilled thru hole core via to get thru to the other side. Fun stuff.

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