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No Thermal Pad - Negative shape?

Pedrator

 Hi, everyone,

 I'm using OrCAD 16.2 to design a simple pcb. The board has two layers, TOP and BOTTOM, both  CONDUCTOR - COPPER. On the TOP layer I have some smd components and some through. On the BOTTOM layer I'l like to have a GND plane. For that, I go to ETCH/BOTTOM and I create a shape add rect, and I configure it as Dynamic Copper and assign it to GND net.

 So far so good, but when I take a look at those pins from through-hole components to be connected to GND plane, I see that there aren't any thermal pad and no clearance pad either. Why is that so? From forum discussions I've been consulting I read that the pad must be assigned to a NEGATIVE plane in order to have the thermal relief in the pads, but I can't find out the way to do this.

 I hope my explanation wasn't to confusing, thanks in advance to anyone that can help me on this.

 

Guillermo.

 

 

  • Check the shape parameters (Shape - Global Dynamic Params) and set your void controls and the Thermal relief connects. You might also need to check that your Shape to Pin Spacing is set. Once that is done everything should display correctly. If it is not then the shape may need updating. Look at (Display - Status) and if required press the Update to smooth button.

    I would steer well clear of Negative shapes. Keep to Positive shapes. WYSIWYG.

  •  Hi, Steve,

    steve said:
    You might also need to check that your Shape to Pin Spacing is set

    Yes, it was the Sape to Pin Spacing that I didn't have it configured. Thank you!

     

    Guillermo.

     

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