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How to define Assembly_Top(bottom) classes for padstacks

Hoodwin
Hi all, I have encountered some problems with defining custom padstack layers used for assembly. For several years I used to insert actual pin projections into assembly layers of padstack. This helps to prepare good-looking assembly drawingas and also helps to check the pad has enough copper around the pin. I found that I also can insert some new layers in the layer tab of pad designer dialog box and these new layers appear in the color192 editor under Stack-up/Non-conductor/Assemply_Top(bottom). But when I mirror the component I see no change in these layers. Pin projections being defined for assembly_top layer remain in that layer while all other elements of symbol geometry go to *_bottom. How can I get PCB editor to know that pin/assembly_top goes into pin/assembly_bottom during symbol mirroring, and vice-a-versa? Best regards...
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  • oldmouldy

    Currently the Custom Layers in the Padstack are not configurable as mirrored, this is likely to be an enhancement to be implemented in an upcoming release. In the meantime, you might want to use the "filmmask" entries, it's unlikely that you will be using these for any other purpose. When you generate the artwork, add the relevant PIN/FILMMASK_TOP (Bottom) to the Assembly output.

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  • oldmouldy

    Currently the Custom Layers in the Padstack are not configurable as mirrored, this is likely to be an enhancement to be implemented in an upcoming release. In the meantime, you might want to use the "filmmask" entries, it's unlikely that you will be using these for any other purpose. When you generate the artwork, add the relevant PIN/FILMMASK_TOP (Bottom) to the Assembly output.

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