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Routing strategies for WLCSP49 package

mpkingsley
Looking for routing guide lines or constraints of Pad size, trace width and copper thickness.
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  • Cadpro2K

     Cool. Where the future is headed. Next up .3mm pitch

     Will need some form of HDI/ALIVH routing technique, dependant on how many GND pins you have.

    Pads should be .25mm - with .12 laser vias in the pads

    GND pads should go directly to a 2nd layer GND plane

    Best case is going 2 structures of micro vias; stacked over each other to break this out, minimum. Pretty common for fabricators - but expensive compared to traditional fabrication.

    Line width will probably need to be .1mm or less, sorry.

    You'll still have some routing challenges, but you'll see. There are also a number of internet articles for routing these packages.

     

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  • Cadpro2K

     Cool. Where the future is headed. Next up .3mm pitch

     Will need some form of HDI/ALIVH routing technique, dependant on how many GND pins you have.

    Pads should be .25mm - with .12 laser vias in the pads

    GND pads should go directly to a 2nd layer GND plane

    Best case is going 2 structures of micro vias; stacked over each other to break this out, minimum. Pretty common for fabricators - but expensive compared to traditional fabrication.

    Line width will probably need to be .1mm or less, sorry.

    You'll still have some routing challenges, but you'll see. There are also a number of internet articles for routing these packages.

     

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