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Footprint

TonyNT
Hi, I'm new to Cadence Editor and I was wondering what would be the best approach to laying out this footprint for a SMT heatsink (to-263). www.ohmite.com/.../showpage.cgi Does the .62" pad separated by solder mask overlap the .64" pad? If so, would I need to use the shape tool for the soldermask? Any help would be appreciated. Thanks, Tony T.
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  • oldmouldy

    Firstly, I think that you need to clarify with the vendor what the Land Pattern provided is supposed to represent.

    My view is that the "large single area" is the soldermask and the "three areas" are the copper, the idea being that the "solderable" sections of the heatsink sit in the gaps between the copper shapes. Based upon that, I designed a single pad for the central area with a soldermask for the "large" area, then added the small, outer, copper shapes to the package symbol. See that attached file. Warning: the provided data is just for illustration purposes,DO NOT make any use of use of the data without verifying that the symbol details meet the requirements for mounting the device correctly.

    d2pohm.zip
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  • oldmouldy

    Firstly, I think that you need to clarify with the vendor what the Land Pattern provided is supposed to represent.

    My view is that the "large single area" is the soldermask and the "three areas" are the copper, the idea being that the "solderable" sections of the heatsink sit in the gaps between the copper shapes. Based upon that, I designed a single pad for the central area with a soldermask for the "large" area, then added the small, outer, copper shapes to the package symbol. See that attached file. Warning: the provided data is just for illustration purposes,DO NOT make any use of use of the data without verifying that the symbol details meet the requirements for mounting the device correctly.

    d2pohm.zip
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