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Want copper shape WITHOUT thermal relief; omit. How?

DrLightning
I have some top-layer copper shapes in a power supply circuit. Lots of current. I do NOT want thermal isolation on these components. I believe they'll assemble/solder fine in the reflow oven without this thermal relief, and I need far more current carrying capacity than the standard thermal relief provides. To date, I just add a wide copper trace at the pad, that covers the thermal relief gap. But this is messy. I've tried changing properties of the shape, but have not been successful. Is there a clean way to do this, where the copper just flows totally through the pad? Obviously, I want it to be included on the correct net name as well. Thanks very much.
  • steve

    Make sure the shape is a dynamic one, then Use Shape - Select Shape or void then LMB the shape then RMB - Parameters, then go to the Thermal Relief Connects tab and change the thru pins, vias or smd pins to Full Contact. This will only effect this one individual shape. If you want to only effect a specific pin or via Hover over it, then RMB Property Edit then look for Dyn_Thermal_Con_Type, change the value to be FULL_CONTACT.

  • DrLightning
    Thanks, Steve. That opened up a whole new world of configuration for me, including simply "Update Shape", which had been causing me some consternation.
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