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.5 mm BGA package breakout

CADcaveman
Curious to see how everyone is routing these fine pitch BGA packages.

the ball pads are 0.010 and that leaves a 0.0097 gap between pads.

So normal pad w/o dogbone required    0.010

so to breakout of the inner rows on the surface layer

Pitch 0.5 mm                      0.0197

Yields gap                            0.0097

4/4/4 would require .012, so 0.0097 allows only 3.2/3.2/3.2

 the 3.2/3.2/3.2 is not manufacturable in volume production.

So with a pad elongated, 12.5 x 7.5, leaves gap 0.0122, which is adequate for 4/4/4

Note 12.5 x 7.5 is slightly bigger area then 0.010 pad

 Has any one had any experience with this type of approach or any other approach other than HDI type routing where you use blind burried vias?

 

Thanks in advance for all help

 
  • budnoel

    Hi Caveman - I'm not an expert but I thought you might find some help in a few articles I have that address this subject.  If you would like, I could email them to you.  Simply send me your off-line email address if you're interested. 

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