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IPC-7351 Level C

C Shiva

Hi all,

Has anyone experienced on using of IPC-7351 level C footprints? Presently I'm using it in one of our project which is a very dense and space constraint board. My concern is,

  1. Is there anything issues we have to take a special care, as to avoid any DFA/DFM?
  2. What is the minimum space we have to keep for two level C footprints (major's and passive's) to avoid any assembly and manufacturing issues?

Any input will be appreciated.

Thanks,

Shiva.

  • SMT machines(particularly Fuji) have been able to place anything we come up with for the past 20 years.  Solder bridging and being able to rework a single part without affecting other parts have been factors.

    You need to get project management involved with assembly engineering. 

    A dumb test board to find out assembly issues in your factory might pay off if you are working on a high-volume design.

    Assembly will want a low-risk/easy board to build.  But, marketing is going to push beyond that.

    Have fun.

  •  My experience has been similar to what Robert posted above.  We place at minimum feature separation (3 to 5 mils) and the boards are fine.  Yes, the assembly houses, especially the poor ones, will cry and complain but the good ones build with no issue.  Rework as he says can be problematic but that is a trade-off necessary to acheive the part density that we are at.

  •  Thanks all for your kind reply. It will be really helpfull.

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