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Minimum blind/buried via stagger distance

true wanderer

Hi,

I'm using a BGA package controller having 0.5mm pitch and 0.3mm ball dia. I'm getting DRC error named "minimum blind/buried via stagger distance whenever i try to place a via on SMD pad of the controller. I'm using blind via which connects layer 1 to layer 3. There's no error if i place via away from the pad. But i can't do that to pins since its a very tight layout. How can i avoid that DRC error???

Any help would be appreciated.

Regards,

Arun

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  • gowthaman90d
    Try updating DRCs...If you still get the errors..give "All_Allowed" option. Via in Pad is good for electrical performance but it is not good for manufacturing and it is costly. There are some extra process like via filling and so on, Study the manufacturing documents,you will get a lot in internet. For adding Constraint region..Go to add shape..Choose Active class as Constraint Region and select subclass as needed..Create seperate Physical Cset and Apply to that region in constraints...If you didn't get this ,Contact me ..I will explain in detail.
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  • gowthaman90d
    Try updating DRCs...If you still get the errors..give "All_Allowed" option. Via in Pad is good for electrical performance but it is not good for manufacturing and it is costly. There are some extra process like via filling and so on, Study the manufacturing documents,you will get a lot in internet. For adding Constraint region..Go to add shape..Choose Active class as Constraint Region and select subclass as needed..Create seperate Physical Cset and Apply to that region in constraints...If you didn't get this ,Contact me ..I will explain in detail.
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