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Donut Pad to Ground Connection

rmerrill

I am using the Pad Editor in Ver. 17.2-2016 S011 at the moment.

I am trying to create a Pad Stack for a Non-Plated Mounting Hole that has a Donut Pad on the Outer Layers to connect to Ground.

Chassis Ground are on Internal Layers so, within the Board, I will be placing a Via and then adding a Trace to the Copper Donut Pad.

Once I define the Outer Layers as a Donut, the Usage Options at the bottom the Summary Page adds "Enable connect by touch: No"

As I seem to need to use Touch, to connect it to a via, without a DRC violation, I am expecting that this should say "Yes".

Richard

Parents
  • I did make a "Mechanical" Part and added the Pad Stack as a pin.
    I then placed the Part manually onto the board.
    Then I tried to connect a via to it. Visually it looks fine, but the DRC Marks it as an error.

    I did try and add it, as you mention, as an "Electrical" part, and, added within Capture with a connection to Ground, but, by doing it that way, the Inner Layer Planes would connect also.
    As it is a non-plated hole, even without inner layer pads, it would create thermal ties to the hole.
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  • I did make a "Mechanical" Part and added the Pad Stack as a pin.
    I then placed the Part manually onto the board.
    Then I tried to connect a via to it. Visually it looks fine, but the DRC Marks it as an error.

    I did try and add it, as you mention, as an "Electrical" part, and, added within Capture with a connection to Ground, but, by doing it that way, the Inner Layer Planes would connect also.
    As it is a non-plated hole, even without inner layer pads, it would create thermal ties to the hole.
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