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Simulation of 2 layer package substrate?

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Good moring!

I am trying to simulate the 2 layer substrate with CPU die and NAND die.
When I run simulation, I meet some problems.

1. It takes to long time to simulate crosstalk summary and reflection summary
(The geomentry window is 20mil, minimum coupled length is 30 mil, Maximum trace length
of substrate is about 2.5 cm(1000mil) )

2. I am not sure that I set the cross-section of 2 layer to conductor Layer instead of Plane in
AP SI.

3. the interconn.iml file is very huge about a couple of hundred MB.

the simulation environment is below
1. 3D Modeling is not set, I use "rule of therm" 1 nH/mm for bond wire, and I insert this
to Die's ibis model for Lpkg value.

2. Simulation frequency is about 28 Mhz, waveform resolution is 50 ps.

3. Plane modeling is not set also.


I can't understand why the simulation time is huge.


Originally posted in cdnusers.org by imsong
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    You need to contact customer service for support.


    Originally posted in cdnusers.org by lwang
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    That's a pretty large geometry window for inside a package. And with a 30 mil min-coupled length you're going to get a very large simulation. Decrease the window and raise length, that will make your simulation smaller and more manageable. Donald


    Originally posted in cdnusers.org by Donald Telian
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    Thank you for repling.
    Donald is right the geometry window is so large.

    I think the Specctraquest can't support 3D field solving such as 2 layer which can't have reference plane.
    If reference plane is not, the inductance of trace is dominent and modeled by inductance.

    Good luck. Inmyoung.


    Originally posted in cdnusers.org by imsong
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