Replace Blind Via with Blind/Buried Stacked Via?

I *think* that this feature is available on a higher license (than I have).  Perhaps there is a simple trick otherwise...

But, as an aside, typically stacking a microvia on top of an internal via is frowned upon since it will almost always crack and cause field failures.  That is another whole subject tho.  Be careful if your fabricator generously allows a mvia on top of an internal.  The "correct" way is with a dogbone offset.  Otherwise an "anylayer" fabrication technique should be used in which case a 1-9 was ok but is *very* expensive.

Here's a link a possible solution that might work.  This can be used for changing a single via into a stack of other vias.

https://www.ema-eda.com/about/blog/why-move-allegro-172-2016-structures-next-generation-high-speed-routing-solution-reason-8

Hi Tmills. I'm still trying to understand what you're attempting, but I'll ask. Can you modify the padstack of the 22/8 L1-L9 via and make it a L2-L9 via (should be easy); then take the L1-L2 microvia and copy it (with "retain net name" turned OFF; and place it over the L2-L9 via you modified. I'm thinking it should understand the stack. I've never done it, but I've place L1-L2 vias over L2-L3 vias and it stacked them. You might have to make sure the Constraint setting allows it though. Just thinking. Good puzzle.

I would create two identical files of your design.

File A has L2-L9 vias which are gloabally replaced from L1-L9 vias.

File B has L1-L2 vias which are gloabally replaced from L1-L9 vias.

The L1-L2 vias are exported out as sub-drawing from File B and imported as sub-drawing into File A.

Now File A has both L1-L2 vias and L2-L9 vias.

That's even easier (assuming it works)! Well thought. Kudos.

Brilliant!  That is a fantastic solution.  One more thing that might be useful is to export the X,Y locations of every via and its type and then do a compare in Excel after masamasa's idea.  There are a few via location SKILL tools available online.