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  3. 0.5mm BGA - tracking - via criteria?

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0.5mm BGA - tracking - via criteria?

archive
archive over 19 years ago

Does anyone have a recommended rule set for tracking out of a .5mm BGA. Its only the two outer rows that are used.  I'm trying to find manufacturers recommendations but so far no joy.

Specifics.

Would you use microvias to escape from the 2nd row, or go between the outer pads on the 'top' layer?
What is the recommended pad size?  (ball dia = .25-.35) but theres nothing about the 'pad' size on the bga which connects the ball.

Thanks..


Originally posted in cdnusers.org by cartouche
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  • archive
    archive over 18 years ago

    Yeah, we've found that 3 mil lines/spacing is preferred (i.e. cheaper) than micro-vias. This is especially true in high-volume production overseas. As micro-vias become more prevalent, that may change.

    At first, I was reluctant to use them (I thought it would be more difficult to design with them), but after doing umpteen boards with micro/blind/buried vias, I practically beg marketing to let me use them.


    Originally posted in cdnusers.org by dgstan
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