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0.5mm BGA - tracking - via criteria?

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Does anyone have a recommended rule set for tracking out of a .5mm BGA. Its only the two outer rows that are used.  I'm trying to find manufacturers recommendations but so far no joy.

Specifics.

Would you use microvias to escape from the 2nd row, or go between the outer pads on the 'top' layer?
What is the recommended pad size?  (ball dia = .25-.35) but theres nothing about the 'pad' size on the bga which connects the ball.

Thanks..


Originally posted in cdnusers.org by cartouche

  • Route between if possible. Microvias are expensive. You will need fine line substrate supplier which is also expensive. Pad size depends on solder mask defined pads or non-solder mask defined pads which again depends on the substrate supplier. Your trying to design in a vacuum. (no offence) You need to identify a substrate supplier and an assembly supplier and obtain their design rules.


    Originally posted in cdnusers.org by SiP

  • So what did you eventually do?? We're curious.


    Originally posted in cdnusers.org by tonykara

  • I've always been forced to use microvias, because they are more common and slightly more reliable than really narrow traces - as far as reliability and yield is concerned.

    .5mm is a pain, but doable.

    Greg


    Originally posted in cdnusers.org by siriusbliss

  • For .5mm BGAs, only outer 2 rows used, I'd tend to go with .003+ traces and not uVias. There are plenty of companies that will do .003" lines using 3/8oz CU. Some might even try using 1/2oz if they're good. I've got 2 suppliers in So. CAL that do it for me at the moment. Getting really good results.

    Good day.
    Mitch


    Originally posted in cdnusers.org by cadpro2k

  • Hi cartouche,
    You can try the following link:
    http://www.pcblibraries.com/resources/GEN-docs.asp
    there are many useful tips aboult BGA layout rules!

    chenli


    Originally posted in cdnusers.org by chenli
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