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IPC7351 Lead Free Land Pattern Spec

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Ha any used IPC7351 Spec for lead free footprints yet? In determining BGA footprint they talk about a collapsing and non collapsing ball. If its collapsing the pad size is reduced if it is non collapsing then the pad size is increased. I have never seen this information on the part data sheets? How does one know? I got this data point

http://www.pcblibraries.com/forum/forum_posts.asp?TID=1599

 off a search but have never seen a BGA specked with a nominal ball of .15 .17 MM

How is everyone else dealing with this?

BOttom line to me is do I really need another footprint for a leaded  vs. a non lead BGA

Thanks
Ahead of time for all answers.


Originally posted in cdnusers.org by CTMusetti
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