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How to create Via stack up

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Please any one help me how to create via stack up (one of my customer asking screen shot of via stack up ) , & is there any command to Drop/delete Unused pads in Via in the Allegro PCB Design L 16.0Version. Regards, Girish_mn


Originally posted in cdnusers.org by girish_mn
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    I am not sure why you have "Film Parameters" section twice under SIG8.art processing section but I will ignore that for now.

    The warning about the layer polarity should be addressed. Your Film Record plot mode should match the cross section layer type. If SIG8 layer contains traces you would want to set the Film Record plot mode and Cross Section layer type both to Negative.

    As far as the missing thermal flash; you will need a thermal flash defined in the listed padstacks in your report so Allegro knows what is to be flashes at the location when the via is connected to the plane and if not it will not be connected because the regular pad is used.

    On Negative planes, selecting the "Suppress Unconnected Pads" option in the film record has no effect with the output because pads will not present just openings in the copper plane. At the locations where a pin or via is connected to the plane a thermal flash is output driven by the padstack definition. If you are using RS274X then you must have a flash symbol (.ssm) created for each of the thermal flash definitions matching the flash names inside your padstack.

    Hopefully I did not lose you with this, but you must be carefully when using negative planes and flashes because it is very easy to get into trouble and generate an unexpected gerber file output.

    Hope this helps,
    Mike Catrambone
    UTStarcom, Inc.


    Originally posted in cdnusers.org by mcatramb91
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  • archive

    I am not sure why you have "Film Parameters" section twice under SIG8.art processing section but I will ignore that for now.

    The warning about the layer polarity should be addressed. Your Film Record plot mode should match the cross section layer type. If SIG8 layer contains traces you would want to set the Film Record plot mode and Cross Section layer type both to Negative.

    As far as the missing thermal flash; you will need a thermal flash defined in the listed padstacks in your report so Allegro knows what is to be flashes at the location when the via is connected to the plane and if not it will not be connected because the regular pad is used.

    On Negative planes, selecting the "Suppress Unconnected Pads" option in the film record has no effect with the output because pads will not present just openings in the copper plane. At the locations where a pin or via is connected to the plane a thermal flash is output driven by the padstack definition. If you are using RS274X then you must have a flash symbol (.ssm) created for each of the thermal flash definitions matching the flash names inside your padstack.

    Hopefully I did not lose you with this, but you must be carefully when using negative planes and flashes because it is very easy to get into trouble and generate an unexpected gerber file output.

    Hope this helps,
    Mike Catrambone
    UTStarcom, Inc.


    Originally posted in cdnusers.org by mcatramb91
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