Celsius – Tip of the week: How to see 3D temperature distribution inside die, via, solder ball, and wirebond in a multiple-die package

Celsius can simulate a multiple-die package and shows 3D temperature distribution at each point of the layout.

When the simulation is complete, go to the Results and Report section in the Workflow pane and click on View 3D T-Distributions. The temperature at different sections of the layout will be available in a new 3D view window.

You can select each section of the layout by clicking on the white square box under the Thermal heading then pressing the Refresh button each time you select a component. It is possible to check the temperature at different points of each component in the package. The temperature distribution of die1 (D1) and die2 (D2) appears as shown below:

More precisely, you can see the temperature of each via, solder ball, and wirebond in the package.

Additionally, it is possible to slice the plane using the slide bar along the X, Y, and Z - axis and check the temperature inside the different components of the layout.

Team SimTech

Cadence Design Systems