How to Solve a Thermal Challenge in a PCB Using Celsius

Celsius has several solvers, including FEA and CFD. Celsius Layered Structures (2.5D FEA) particularly stands out as an ideal platform for quick thermal simulations that let users create a 3D thermal model via wizards and templates without thermal expertise.

The RAK available on support.cadence.com demonstrate a thermal analysis methodology of solving a thermal challenge in a PCB using Celsius FEA and CFD Technology of Cadence. The RAK cover the thermal analysis process that PCB designers or PCB SI/PI engineers can utilize in Celsius 2.5D FEA to come up with a cooling mechanism for PCBs. Then, the same users or the thermal engineers can do a final signoff of an actual design using Celsius CFD simulation. The workflow of Celsius 2.5D FEA-CFD is used in this RAK, letting users do a trade study of cooling the PCB quickly in 2.5D FEA and run an actual CFD simulation, including a chassis and a fan, in the CFD environment.

The Celsius 2.5D FEA-CFD Workflow Diagram:

SimTech 

Cadence Design Systems