What's New in Celsius Studio Systems Analysis 2024.0

Cadence Celsius Studio, industry’s first complete AI-enabled multi-physics analysis platform for electronic systems has been introduced in this release. This innovative platform delivers unparalleled capabilities in electro-thermal simulation, warpage and stress evaluation, electronics cooling, and thermal network extraction and simulation. It enables electrical and mechanical/thermal engineers to conduct analysis within a unified platform without the need for geometry simplification, manipulation, or translation. Celsius Studio leverages generative AI optimization through Cadence Optimality Intelligent System Explorer to rapidly explore the design space and converge on the optimal design.

The suite of products within Celsius Studio enables seamless integration of ECAD and MCAD design files, streamlining workflows and facilitating rapid in-design analysis.

• Celsius Layout: Facilitates IR-drop, thermal, and warpage/stress analyses, along with electro-thermal and stress co-simulations of layered structure designs, such as PKGs and PCBs with multiple layers and interconnect vias. It also supports thermal model extraction for use in thermal network simulation and leverages Optimality Intelligent System Explorer—an (AI)- driven multidisciplinary analysis and optimization (MDAO) technology—for rapid design optimization.
• Celsius 3D Workbench: Enables IR-drop, thermal, and warpage/stress analyses, along with electro-thermal and stress co-simulations of 3D structure designs. It also supports thermal model extraction for use in thermal network simulation and leverages Optimality Intelligent System Explorer— an (AI)- driven multidisciplinary analysis and optimization (MDAO) technology—for rapid design optimization.
• Celsius 3DIC: Supports the creation of customized 3D-IC designs in schematic view or the import of designs from the Integrity 3D-IC Platform. It provides comprehensive thermal analysis, as well as warpage and stress analysis capabilities for complex 3D-ICs and structures.
• Celsius Electronics Cooling: Addresses challenging thermal/electronics cooling management problems with speed and precision. Celsius Electronic Cooling leverages a powerful computational engine and meshing technology to effectively model and analyze complex designs.
• Celsius Thermal Network: Enables the simulation of thermal networks using thermal models extracted from the Celsius Layout and Celsius 3D Workbench tools. It is particularly useful for conducting macroscopic analysis, system-level calculations, thermal characterization, model calibration, and sensitivity analysis.

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