Thermal Warpage Simulation in Celsius

There has been great deal of interest in electronic design automation(EDA) in electronics industry due to the huge potential on the next generation technologies such as 5th generation(5G) mobile network, high performance computing, autonomous vehicle, meta universe. All these applications required a powerful semiconductor device as their computational unit. For a much higher computing performance, besides the circuit design, the temperature field induced by the circuit power, or the thermal stress analysis during manufacturing process, become more and more important due to the geometry and performance requirement.

A reliable numerical tool, then plays an important role at the early stage of electronic design. An accurate, faithful prediction and evaluation of the design with appropriate numerical modeling can help designer foresee possible issues and save much more development cost. As the Moore’s law stated, semiconductor process technology has been increased in complexity but decreased in size. The limiting space of the device makes the thermal diffusion and stress deformation of each component be the critical issues. The deformation of the component in tiny space will cause huge deflection and undesired conditions of the circuit. Therefore, a numerical tool that focusing on thermal and stress analysis is needed.

Moreover, during stress analysis, the tool should contain several features according to the industrial needs. First, the thermal expansion should be taken into account, as well as the deformation due to thermal expansion mismatch. Next, the temperature dependent material properties should be considered. Some common components such as underfill, epoxy, have glass transition at specific range of temperature, such that the mechanical properties change significantly near this range. This highly temperature dependent characteristics is usually used to reduce the deformation or warpage due to coefficient of temperature expansion (CTE) mismatch between essential components.

Cadence Celsius Thermal Solver, is the product that provided a solution on multi-physics simulation at system level with performing both thermal and stress analysis. To validate the solver, several cases with analytical solutions and shadow Moire experimental measurement from literature are used to make comparison with numerical simulation result, demonstrating the capability of Cadence Celsius Thermal Solver.

To study more about Thermal Warpage Simulation, click here.

Team SimTech 

Cadence Design Systems