Bondwires inductance with differential or common mode signal

Hello,

I am making a PCB interface using bondwires from a chip to a PCB waveguide. The signal is a differential signal and the bondwires are placed close to each other. I would have expected this differential signal would reduce the inductance of the bondwires. However, when I only simulate bondwires as shown in the image below (two ground bondwires on the outside, a ground plane and Ro4350b medium) the inductance given by clarity doesn't change whether the ports are differential (left) or not (right). I used the general RLGC view and the ports are 50 ohm lumped ports between the copper GND plane and the copper signal layer. The ports are indicated as differential ports when checking "edit differential ports" and are properly linked. Does clarity 3D require additional settings to simulate 2 simultaneous signals or does it always just simulate one port at a time (which it seems like it does). I also compared it to a bondwire simulation in ADS and there I do get a lower inductance with a differential net compared to a common port.

If additional info is required i will gladly give it.

Thank you in advance