Virtuoso: The Next Overture - Virtuoso RF Solution for High Frequency Product Designs

The new release of the Virtuoso platform (ICADVM18.1) offers groundbreaking analysis capabilities and an innovational new simulation-driven layout for more robust and efficient design implementation as well as extending our support for the most advanced process technologies. With this solution, we are able to significantly improve productivity through advanced methodologies and provide the most comprehensive set of solutions in the industry with an interoperable flow across chip, package, module and board.

Every once in a while, a new technology, an old problem, and a big idea turn into an innovation.

Dean Kamen

The latest Advanced Methodology Virtuoso release (ICADVM18.1) introduces Virtuoso^® RF Solution that allows you to create modules and packages in Virtuoso by leveraging new package design capabilities.

The solution removes a long-standing problem caused by the use of disparate design tools for IC design versus module and package design. Virtuoso RF Solution provides an integrated co-design cockpit for in-concert editing of different fabrics from IC to modules and packages through:

• Support for multiple IC and packaging technologies
• True golden schematic-driven design flow for the package or RF module design
• Built-in Layout versus Schematic (LVS) capabilities that guarantee design correctness
• Off-chip layout editing capabilities, such as device placement at any angle and routing, curved connect lines, and voids
• In-context viewing and editing of IC and package layout
• Integrated Electromagnetic solvers (MoM and FEM) to generate accurate and realistic models for simulations

Furthermore, the barrier between Virtuoso and Allegro platforms is lowered and will let you benefit from the unified flow while retaining the efficiency of the individual platforms.

                                                                                            Virtuoso RF Solution

Challenges of IC/Module/Package/Board Designs

Traditionally, IC and package designs are done in isolation with different design teams using their own tools. However, with the advent of complex designs in communication and automotive leading to 5G, combined with the pressure of the tight go-to market window, the traditional design flows can often lead to non-functional designs being taped out.

Current Module Assemble Stackup

To overcome some of the tool limitations, users create home-grown design flows that create subset models and manually stitch the models into the system schematic. However, when there is a need to incorporate multiple IC technologies, such as CMOS, SiGe, GaAs, GaN, InP, and so on, and filter technologies, such as SAW and BAW, on the same module, the home-grown solutions do not scale. Virtuoso RF solution addresses these challenges and supports a true multi-technology driven solution. This robust solution extends the Virtuoso schematic connectivity driven layout capabilities to RF module and package designs by allowing you to select critical subsets of the layout for accurate extraction and automatically stitch the models back into a golden schematic.

Schematic-Connectivity-Driven Layout Design

The built-in Layout Versus Abstract (LVA) and co-design capabilities will allow you to ensure that connectivity is maintained all the way from package balls to the IC bumps/pillars and inside the IC layout. To precisely account for high-frequency effects on design performance, it is required to use electromagnetic (EM) tools for accurate extraction. However, the use of EM tools increases the complexity of data exchange, which further makes it difficult to maintain and scale home-grown schematic-layout-extraction design flows. Ultimately, it becomes impossible to guarantee What You Simulate is What You Implement (WYSIWYI) in home-grown design flows!

Interactions Across Multiple EDA Tools

To answer that, Virtuoso RF solution encompasses electromagnetic solvers that are tightly integrated within the design environment. The EM solvers can be run directly in Virtuoso Layout without the need to create an EM layout. Also, the resultant S-Parameters are automatically inserted in an extracted view, which ensures that the golden schematic and layout are undisturbed.

Integrated EM Tools Providing Layered and Stacked EM Analysis Capability

This solution encourages greater collaboration across design disciplines and allows designers to focus on product innovation rather than the mundane details of data translation. It will inspire designers to innovate with the product designs instead of spending the time in translating designs across multiple tool boundaries.

Virtuoso RF Solution is the next generation design flow for the next generation of products. Sounds exciting? Stay tuned for our Virtuoso Advanced Nodes and Methodologies release ICADVM18.1.

Related Resources

Virtuoso RF Solution

For more information on Cadence circuit design products and services, visit www.cadence.com.

Contact Us

For more information on the New Virtuoso Design Platform, or if you have any questions or feedback on the features covered in this blog, please contact team_virtuoso@cadence.com.

If you would like to receive similar updates about new and exciting features being built into Virtuoso for our upcoming Advanced Nodes and Advanced Methodologies releases, type your email ID in the Subscriptions field at the top of the page and click SUBSCRIBE NOW.

Sutirtha Kabir and Deepti Mishra Gupta (Team Virtuoso)