Voltus Voice: Voltus-Celsius Integration for System Analysis —The Super Simple Way

Voltus^TM IC Power Integrity Solution is a power integrity and analysis signoff solution that is integrated with the full suite of design implementation and signoff tools of Cadence to deliver the industry’s fastest design closure flow. The aim of this blog series is to broadcast the voices of different experts on how design engineers can effectively use the diverse Voltus technologies to achieve high-performance, accuracy, and capacity for next-gen chip designs.

In the words of Albert Einstein, the definition of genius is taking the complex and making it simple. We at Cadence are firm believers of this ideology and are dedicated towards providing simpler solutions for your complex design problems. One such “genius” solution is the Voltus integration with Celsius that offers modern thermal analysis solution for complex electronic design issues.

Design engineers want experiences that offer design insights and empower them to detect and mitigate thermal issues early in the design process—reducing electronic system development iterations. And to show how the Voltus-Celsius integration applies the Cadence Intelligent System Design strategy to make chip thermal optimization easy, we have created a video, the third in the 'Chip-2-System Power Signoff' video series. While earlier videos in this series described Voltus integration with Sigrity and Innovus technologies, this video is about the Voltus-Celsius integration and how that achieves faster system-level thermal and power integrity analysis and closure.

Voltus is strongly integrated with Celsius Thermal Solver for analyzing IC packages, PCBs, and systems. This integration allows the engineering teams to combine electrical and thermal analysis and simulate the flow of both electricity and heat for an accurate system-level thermal simulation. The Voltus-Celsius solution can help overcome several thermal challenges, such as high power density, poor heat dissipation, and non-homogeneous power distribution that arise while working on 3D integration and advanced packaging of multiple stacked dies.

So, to give design engineers a way to overcome the complexity of thermal analysis, this solution helps them:

• Perform electrical-thermal co-simulation for electronic systems
• Evaluate power profiles and temperature variations in IC packages
• Accomplish dynamic thermal management with focus on performance, power control, and reliability

You can learn more about these features with the Voltus-Celsius integration video. The video will further unfold the following benefits of the integrated solution.

So, do watch this third video of the ‘Chip-2-System Power Signoff’ video series and explore the Cadence solution for 3D-IC Chip-Centric Power and Thermal Integrity.

Stay tuned for more videos in the series!

Related Resources

For more information on Cadence digital design and signoff products and services, visit www.cadence.com/go/voltushs.

About Voltus Voice

“Voltus Voice” showcases our product capabilities and features, and how they empower engineers to meet time-to-market goals for the complex, advanced-node SoCs that are designed for next-gen smart devices. In this monthly blog series, we also share important news, developments, and updates from the Voltus space.